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Technology5h 18m ago

SMIC is currently shipping its third-generation 7 nm (N+3) process technology in Huawei’s Kirin 9030, featuring a minimum metal pitch of 32.5 nm.

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Oregon (SemiAnalysis Teardown Engineering & Evaluation Lab), China (SMIC, Huawei)

Who
SMIC, Huawei, SemiAnalysis, Intel, TSMC
What
SMIC is currently shipping its third-generation 7 nm (N+3) process technology in Huawei’s Kirin 9030, featuring a minimum metal pitch of 32.5 nm.
When
Sun, 14 Jun 2026 19:14:21 GMT · 5h 18m ago
Where
Oregon (SemiAnalysis Teardown Engineering & Evaluation Lab), China (SMIC, Huawei) ·
Why
SemiAnalysis conducted a reverse engineering and teardown of Huawei's Kirin 9030 to analyze SMIC's N+3 process technology and its capabilities in the context of global export controls.
The Frontline Impact

How this affects you

This analysis reveals that despite export controls, China's SMIC has achieved N6-class logic density through aggressive DUV multi-patterning, though it trails leading-edge nodes in efficiency and process maturity, influencing the competitive landscape of advanced chip manufacturing.

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  1. Currently Reading5h 18m ago
    SMIC is currently shipping its third-generation 7 nm (N+3) process technology in Huawei’s Kirin 9030, featuring a minimum metal pitch of 32.5 nm.
  2. Technology5h 18m ago
    SMIC is shipping its third-generation 7 nm (N+3) process in Huawei’s Kirin 9030, with a minimum metal pitch of 32.5 nm.
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