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Technology3h 51m ago
SMIC is shipping its third-generation 7 nm (N+3) process in Huawei’s Kirin 9030, with a minimum metal pitch of 32.5 nm.
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Oregon
Who
SMIC, SemiAnalysis, Huawei, TechInsights
What
SMIC is shipping its third-generation 7 nm (N+3) process in Huawei’s Kirin 9030, with a minimum metal pitch of 32.5 nm.
When
Sun, 14 Jun 2026 19:14:21 GMT · 3h 51m ago
Where
Oregon ·
Why
SemiAnalysis conducted a reverse engineering and teardown of the Kirin 9030 to analyze SMIC's N+3 process technology.
The Frontline Impact
How this affects you
This report highlights China's progress in advanced semiconductor manufacturing despite export controls, demonstrating that SMIC's N+3 node can achieve logic density comparable to TSMC N6, even without EUV lithography. This allows Huawei to continue developing advanced silicon for its devices.
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2 events in this thread- Technology3h 51m agoSMIC is currently shipping its third-generation 7 nm (N+3) process technology in Huawei’s Kirin 9030, featuring a minimum metal pitch of 32.5 nm.Open article
- Currently Reading3h 51m agoSMIC is shipping its third-generation 7 nm (N+3) process in Huawei’s Kirin 9030, with a minimum metal pitch of 32.5 nm.